CMP
CMP는 화학적인 Etching방식과 기계적인 Polishing을 동시에 수행하여 울퉁불퉁한
반도체 웨이퍼 표면을 매끄럽게 평탄화시키는 공정입니다.
㈜티에스시는 CMP설비의 부품과 소재 등을 직접개발 또는 Repair 합니다.
반도체 웨이퍼 표면을 매끄럽게 평탄화시키는 공정입니다.
㈜티에스시는 CMP설비의 부품과 소재 등을 직접개발 또는 Repair 합니다.
TSC Rotary Joint
Category | Develoed Product |
---|---|
Application | EBARA FREX300 |
Feature | OVERHAUL |
Explanation | – New production – TSC Test system |
FSB
Category | Develoed Product |
---|---|
Application | All FAB |
Feature | Facility Supply Box |
Explanation | – New production – Installed in the FAB |
RR VISION
Category | Develoed Product |
---|---|
Application | AMAT LK, REFLXION |
Feature | This system is developed to detect scratches occurred by the impurities during the CMP process. The system detects scratches found on the Retainer Ring. |
Explanation | – New production – Facility Supply Box – Installed in the FAB |
Brush VISION
Category | Develoed Product |
---|---|
Application | AMAT LK, REFLXION |
Feature | Brush Gap Check Tool |
Explanation | New production |
Temp Monitoring
Category | Develoed Product |
---|---|
Application | AMAT LK, REFLXION |
Feature | Temp monitoring to equipment |
Explanation | New production |
Conditioner Head
Category | Repair |
---|---|
Application | AMAT LK, REFLXION |
Feature | OVERHAUL |
Explanation | – Main Part’s Replacement – TSC Test system |
Arm Base
Category | Repair |
---|---|
Application | AMAT LK, REFLXION |
Feature | OVERHAUL |
Explanation | – Main Part’s Replacement – TSC Test system |
Spindle
Category | Repair |
---|---|
Application | AMAT LK, REFLXION |
Feature | – Main Part’s Replacement – TSC Test system |
Explanation | – New production – Facility Supply Box – Installed in the FAB |
Rotary Joint
Category | Repair |
---|---|
Application | EBARA FREX300 |
Feature | OVERHAUL |
Explanation | – Main Part’s Replacement – TSC Test system |
UPA(MKS BOX)
Category | Repair |
---|---|
Application | AMAT LK, REFLXION |
Feature | OVERHAUL |
Explanation | – Main Part’s Replacement – TSC Test system |