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CMP BUSINESS

As a business startup item of the company, this product is
compatible to AMAT and Ebara based on the accumulated technology and know-how for
more than 20 years, and we also possess independently developed products

CMP 2021-08-20T03:51:55+00:00

CMP

CMP is a process that flattens the surface of a semiconductor wafer by implementation of
chemical etching method and mechanical polishing simultaneously.
TSC directly develops or repairs components and materials of CMP facilities

TSC Rotary Joint

Category Develoed Product
Application EBARA FREX300
Feature OVERHAUL
Explanation – New production
– TSC Test system

FSB

Category Develoed Product
Application All FAB
Feature Facility Supply Box
Explanation – New production
– Installed in the FAB

RR VISION

Category Develoed Product
Application AMAT LK, REFLXION
Feature This system is developed to detect scratches occurred by the impurities during the CMP process. The system detects scratches found on the Retainer Ring.
Explanation – New production
– Facility Supply Box
– Installed in the FAB

Brush VISION

Category Develoed Product
Application AMAT LK, REFLXION
Feature Brush Gap Check Tool
Explanation New production

Temp Monitoring

Category Develoed Product
Application AMAT LK, REFLXION
Feature Temp monitoring to equipment
Explanation New production

Conditioner Head

Category Repair
Application AMAT LK, REFLXION
Feature OVERHAUL
Explanation – Main Part’s Replacement
– TSC Test system

Arm Base

Category Repair
Application AMAT LK, REFLXION
Feature OVERHAUL
Explanation – Main Part’s Replacement
– TSC Test system

Spindle

Category Repair
Application AMAT LK, REFLXION
Feature – Main Part’s Replacement
– TSC Test system
Explanation – New production
– Facility Supply Box
– Installed in the FAB

Rotary Joint

Category Repair
Application EBARA FREX300
Feature OVERHAUL
Explanation – Main Part’s Replacement
– TSC Test system

UPA(MKS BOX)

Category Repair
Application AMAT LK, REFLXION
Feature OVERHAUL
Explanation – Main Part’s Replacement
– TSC Test system