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CMP BUSINESS

TSC의 창업 아이템으로서 20년 이상의 축적된 기술과 know-how를 바탕으로
AMAT社와 Ebara社 대응이 가능하며 자체 개발 제품도 보유 중입니다.

CMP 2021-11-16T10:57:54+00:00

CMP

CMP는 화학적인 Etching방식과 기계적인 Polishing을 동시에 수행하여 울퉁불퉁한
반도체 웨이퍼 표면을 매끄럽게 평탄화시키는 공정입니다.
㈜티에스시는 CMP설비의 부품과 소재 등을 직접개발 또는 Repair 합니다.

TSC Rotary Joint

Category Develoed Product
Application EBARA FREX300
Feature OVERHAUL
Explanation – New production
– TSC Test system

FSB

Category Develoed Product
Application All FAB
Feature Facility Supply Box
Explanation – New production
– Installed in the FAB

RR VISION

Category Develoed Product
Application AMAT LK, REFLXION
Feature This system is developed to detect scratches occurred by the impurities during the CMP process. The system detects scratches found on the Retainer Ring.
Explanation – New production
– Facility Supply Box
– Installed in the FAB

Brush VISION

Category Develoed Product
Application AMAT LK, REFLXION
Feature Brush Gap Check Tool
Explanation New production

Temp Monitoring

Category Develoed Product
Application AMAT LK, REFLXION
Feature Temp monitoring to equipment
Explanation New production

Conditioner Head

Category Repair
Application AMAT LK, REFLXION
Feature OVERHAUL
Explanation – Main Part’s Replacement
– TSC Test system

Arm Base

Category Repair
Application AMAT LK, REFLXION
Feature OVERHAUL
Explanation – Main Part’s Replacement
– TSC Test system

Spindle

Category Repair
Application AMAT LK, REFLXION
Feature – Main Part’s Replacement
– TSC Test system
Explanation – New production
– Facility Supply Box
– Installed in the FAB

Rotary Joint

Category Repair
Application EBARA FREX300
Feature OVERHAUL
Explanation – Main Part’s Replacement
– TSC Test system

UPA(MKS BOX)

Category Repair
Application AMAT LK, REFLXION
Feature OVERHAUL
Explanation – Main Part’s Replacement
– TSC Test system